Development boards and modules
Solderless breadboard, 170 tie points
A solderless breadboard; tie points 170, dimensions 47 x 35 x 9 mm. For prototyping, test rigs, monitoring and small automation projects with microcontroller boards.
- Product group
- Development boards and modules
- Tie points
- 170
- Dimensions
- 47 x 35 x 9 mm
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Datasheet, stock and lead time on request. If this part is discontinued or on long lead time we offer an approved equivalent.
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